Ideally, you will have :
Over 5 years hand-on experience in semiconductor module packaging or test, especially, Camera Module, laser, LED or related Process
Fluent in English communication, additional language skills a plus
Experienced working with subcontract manufacturing partners
Experience in semiconductor module assembly required, with camera module, laser optics, LED and prox modules a plus.
High volume manufacturing, and production ramp experience
Knowledgeable in production control processes, machine commissioning, data analysis / interpretation GR&R, Cp / Cpk and correlation analysis, MSA;
In this role, you are to work in a close and collaborative relationship with subcontract manufacturing partners engineering teams to develop the HVM infrastructure required to produce the highest quality hardware.
Responsibilities include : - Develop Camera Module manufacturing & Test process / equipments / materials for FOL (Front Of Line) and EOL (End Of Line) - Develop new manufacturing process / equipment / material for Camera module related components;
Provide technical leadership in resolving any process or test related issue; - Responsible for developing DOEs, Statistical Process Analysis, Process specification, D / PFMEA and Process control plan - Responsible for Failure analysis, Corrective actions and Yield improvement
Education & Experience
Degree in Engineering (Mechanical, Electronics, Electrical, Physics or equivalent)