Ideally, you possess a strong command of failure analysis methods and corresponding field experience :
3+ years experience in electrical fault isolation
3+ years in physical FA using X-ray / SEM / CSAM / FIB / X-sect
Experience in surface morphology tools
Knowledge of IC assembly packaging design, process and testing
Ability to work independently, yet also be a strong team-player who thrives in dynamic and ever-changing work environments.
Strong solution-focused work ethic with a high degree of flexibility supporting multiple projects of varying complexity and priority.
Self-motivated with strong written and verbal communications skills
Provide comprehensive Failure Analysis during development NPI process Work with various functional teams for root cause identification, simulation and solutions.
Education & Experience
Degree / Master holder in Materials / Chemistry / Electrical Engineering