At Xilinx, we are leading the industry transformation to build an adaptable, intelligent world. ARE YOU bold, collaborative, and creative?
At Xilinx, we hire and develop leaders and innovators who want to revolutionize the world of technology.We believe that by embracing diverse ideas, pushing boundaries, and working together as ONEXILINX, anything is possible.
Our culture of innovation began with the invention of the Field Programmable Gate Array (FPGA), and with the 2018 introduction of our Adaptive Compute Acceleration Platform (ACAP), has made a quantum leap in capability, solidifying our role as the adaptable platform supplier of choice.
From the start, we have always believed in providing inventors with products and platforms that are infinitely adaptable.
From self-driving cars, to world-record genome processing, to AI and big data, to the world’s first 5G networks, we empower the world’s builders and visionaries whose ideas solve every day problems and enhance people’s lives.
If you are PASSIONATE, ADAPTABLE, and INNOVATIVE, Xilinx is the right place for you!At Xilinx we care deeply about creating meaningful development experiences while building a strong sense of belonging and connection.
We foster an environment of empowered learning, wellness, community engagement, and recognition, so you can focus on work that matters world class technology that improves the way we live and work.We are ONEXILINX.
We are looking for a talented, self-driven and motivated mechanical engineer to be part of a technology development team in Xilinx.
This team develops cutting-edge technologies used in our products and its team members have ample opportunities to grow their technical knowledge and complex problem-solving skills.
In this position, this engineer will work in the thermo-mechanical product development and the introduction of the solution to the production.
The candidate will need to have strong experience in understanding of the mechanical design and heat transfer of electronics equipment and packaging.
We Are Looking For Someone Who Demonstrates
Experience And Skills
Mechanical pressure measurement,
Mechanical warpage using Shadow Morrie’, DIC,
FIB, SEM, TMA, DMA, MTS, X-ray, C-SAM, T-SAM
Air flow measurement and thermal measurement