Die Attach Principal Engineer Description Job Description Develop and transfer Flip Chip processes. Drive process / product characterization, process development.
Products, process, and technologies introduction within requirement and ensuring process robustness and manufacturability, profitable yields and cost effectiveness, complete with post-
release care. Collaborate with other teams (internal or external) to plan and perform experiments. Do yield analysis and lead trouble-
shooting of defect and yield issues and process excursions related with new process / tools. Job Requirements PhD / Master / Bachelor degree in Electrical / Materials / Electronics / Mechanical / Chemical Engineering or other relevant discipline with min.
5 years of experience in Die Attach related field. Experience in flip-chip bonding, overmold, laser lift off, package design.
Experience in process integration, yield engineering, technology transfer, unit / module process development, SPC. The above information on this description has been designed to indicate the general nature, and level, of the work performed by this position.
It is not designed to contain, or be interpreted, as a comprehensive inventory of all duties, responsibilities and qualifications required.
Country Singapore Company Semiconductor MNC Salary From US$40,000 Working Hours Full-Time Contract Permanent Categories Chemical, Electrical / Electronics / Instrumentation / Control Industries null