The candidate will work in the Process and Test Engineering group, responsible to develop assembly and test processes, equipment and materials for leading edge optical modules.
Will work in a close and collaborative relationship with subcontract manufacturing partners engineering teams to develop the HVM infrastructure required to produce the highest quality hardware.
Experience in semiconductor module assembly required, with camera module, laser optics, LED and prox modules a plus.
Over 5 years hand-on experience in semiconductor module packaging or test, especially, Camera Module, laser, LED or related Process,
Fluent in English communication, additional language skills a plus
Experienced working with subcontract manufacturing partners
High volume manufacturing, and production ramp experience
Knowledgeable in production control processes, machine commissioning,data analysis / interpretation GR&R, Cp / Cpk and correlation analysis, MSA;
Develop Camera Module manufacturing & Test process / equipments / materials for FOL (Front Of Line) and EOL (End Of Line)
Develop new manufacturing process / equipment / material for Camera module related components;
Provide technical leadership in resolving any process or test related issue;
Responsible for developing DOEs, Statistical Process Analysis, Process specification , D / PFMEA and Process control plan
Responsible for Failure analysis, Corrective actions and Yield improvement
Degree in Engineering (Mechanical, Electronics, Electrical, Physics